Micron's New 512GB Memory Module Deepens Its AI Infrastructure Advantage

Micron Technology says it has demonstrated the industry’s first 512GB DDR5 high-density memory module for server platforms, aimed at easing the “memory wall” that leaves processors waiting during large-model inference. Using vertical 3D packaging with stacked DRAM dies connected by through-silicon vias, the RDIMM design fits up to 12TB of DDR5 DRAM into a standard 24-slot, dual-socket server. Micron claims data rates up to 9,200 MT/s and a power draw of about 16.0W per 512GB module versus 44.2W for four 128GB modules. Testing shows throughput gains up to 1.4x versus prior 256GB setups. AMD and Intel are qualifying it for upcoming systems.