Micron strengthens Singapore footprint with US$24bil investment in AI-driven manufacturing

Micron is deepening its manufacturing presence in Singapore with two investments aimed at expanding advanced production for AI demand. The company said the moves reflect its long-term commitment to memory and storage technologies powering the “AI future,” supported by Singapore government backing and ecosystem partners. Micron is progressing construction of its high-bandwidth memory (HBM) advanced packaging facility, announced in January 2025, with initial output expected in early 2027. That site is its first HBM advanced packaging plant outside Taiwan and will cost about US$7 billion through the end of the decade. In addition, a new advanced wafer fabrication facility—groundbreaking held January 2026—should start operations in the second half of 2028, with roughly US$24 billion planned over 10 years, making it Singapore’s first double-story wafer fab.