Samsung Reportedly Taps TSMC for Nvidia's Next-Gen Memory - Taiwan Semiconductor (NYSE:TSM)

Samsung reportedly plans to use Taiwan Semiconductor Manufacturing Co. (TSMC) for the “base die” in Nvidia’s next-generation custom high-bandwidth memory. Sources cited by the Seoul Economic Daily say Nvidia is asking its three memory suppliers—Samsung, SK Hynix, and Micron—to manufacture the base die, plus the logic layer at the bottom of the HBM stack, on TSMC’s 3-nanometer process. Nvidia also wants the core die standardized on the 6th-generation 1c DRAM process, with Samsung’s Device Solutions division accepting the request after an internal review. Nvidia unveiled NVHBM in August, targeting up to 30% more bandwidth and 15% lower power than standard HBM4E. TSMC declined to comment.