Hynix DRAM Capacity Roadmap Revealed: Yongin Alone Adds 360K Wafers Monthly

Hynix's DRAM capacity roadmap centers on the Yongin cluster south of Seoul, where a six-cleanroom ramp is designed to lift monthly wafer starts from about 550,000 today to roughly 1 million by 2030–2031. Briefings to equipment and materials suppliers over the past two months spell out a six-phase cadence, with six cleanrooms collectively adding 60,000 wafers every six months and delivering equal increments six months apart. The first Yongin cleanroom's equipment installation has been moved up to February 2027, from an earlier target of May 2027. The plan signals SK hynix's intent to expand memory capacity as AI demand accelerates.