SkyeChip joins Rapidus ecosystem for Japan's 2nm chip platform

SkyeChip Bhd has joined Rapidus CORE, entering Japan’s Rapidus semiconductor ecosystem as a Design Solution Associate. The Malaysian integrated circuit design company says it will contribute silicon intellectual property (IP) for artificial intelligence (AI) and high-performance computing (HPC), along with its IC design expertise. The collaboration is meant to support customers developing next-generation AI and HPC chips using Rapidus Corp’s process technologies. Rapidus, founded in Japan in 2022, is working to develop 2-nanometre chip manufacturing capabilities targeted for 2027. SkyeChip CEO Datuk Fong Swee Kiang said the appointment recognizes the depth of SkyeChip’s AI and HPC silicon IP and engineering capability.