Ceva and LG Validate First Full-Stack UWB IP on TSMC 22nm: Anchor Customer Already Licensing

Ceva and LG Electronics announced on September 9, 2026 that they have validated a full-stack ultra-wideband (UWB) IP package on TSMC’s 22-nanometer ultra-low-power process. The pre-characterized subsystem combines digital baseband, MAC software, and an RF analog front-end, and the companies also say a major U.S. semiconductor customer has already licensed the combined stack. The timing aligns with IEEE’s expected 802.15.4ab publication before the end of 2026. The article argues the integration burden is reduced for system-on-chip teams because RF and digital layers are pre-co-optimized and validated before a licensee’s tape-out.